Electron beam lithography (EBL) is a promising maskless solution for thetechnology beyond 14nm logic node. To overcome its throughput limitation,recently the traditional EBL system is extended into MCC system. %to furtherimprove the throughput. In this paper, we present E-BLOW, a tool to solve theoverlapping aware stencil planning (OSP) problems in MCC system. E-BLOW isintegrated with several novel speedup techniques, i.e., successive relaxation,dynamic programming and KD-Tree based clustering, to achieve a good performancein terms of runtime and solution quality. Experimental results show that,compared with previous works, E-BLOW demonstrates better performance for bothconventional EBL system and MCC system.
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